 The Fast & Easy Way for Automatic Defect Classification With High Performance Leica ADC HP is a new generation High Performance Automatic Defect Classifica- tion solution. This low Cost of Ownership solution is provided as an easy to use, fast and highly accurate software option for Leica Microsystems Optical Inspection & Review Systems. Leica ADC HP reduces semiconductor manufacturing operating costs by increas- ing the probe yield learning rate, reducing time-to-detect and time-to-correct of ex- cursions. To be successful in today’s advanced semi- conductor manufacturing world, you need ADC. In combination with statistical process control, ADC can be used to mon- itor the entire manufacturing process. Classification and trending of defect types is essential in the investigation of process Leica ADCHP irregularities.
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 Thin-Film Metrology The Leica APECS3020 is a fully auto- mated thin film metrology tool for inline process control of film thickness and optical parameters such as refractive index, absorption coefficient and re- flectivity. Innovative solutions support the monitoring of surface roughness, interfaces, material fractions and de- position/etch rates. Delivering peak performance for a broad range of ap- plications along with the new concept to shorten recipe setup time, the APECS3020 is the tool of choice for foundries and ASIC-fabs.
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 Electronic Beamwriter for Direct-Write Applications The Leica EBPG series products have established a world-wide leading posi- tion for advanced nanolithography ap- plications, particularly in direct writing premium GaAs communication devices. Their proven delivery of reliable 100 keV beam energy operation, sub-10 nm linewidth performance, high placement accuracy and extensive, easy to use software has led to this “tool of choice” reputation.
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 OEM Microscope Module for Universal Applications The Leica INH200 is a microscope mod- ule based on Leica INM200 UV platform for use in customized OEM solutions. It is particularly suitable for measurement and inspection systems in the field of wafer, mask and LCD production. The unique feature of a focussing ob- jective nosepiece (optional) controlled by the Leica laser-focus-system ne- gates the need for a height-adjustable specimen stage for focussing. The module was specially designed for easy OEM system integration.
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 Fully Automated OEM Microscope Module The Leica INH3000 DUV is a fully auto- mated microscope module based on the Leica INS3000 DUV platform for use in customized OEM solutions. It is de- signed particularly for high perform- ance measurement and inspection sys- tems in the field of wafer, mask and LCD production. The combination of three wavelength ranges VIS, UV (365 nm) and DUV (248 nm) on one system together with the unique Leica Airspace-Technology DUV Objectives (cement-less optics) add an important advantage to your system.
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 Universal Inspection Microscope The Leica INM100 is the newly de- signed modular microscope system for masks and wafers up to 8”. This latest development in the area of visual inspection is state-of-the-art in its class and features. The new Leica INM100 can be retrofit- ted with a desktop wafer handler for macro, micro and backside inspection. The combination of the Leica INM100 and the wafer handler results in the easy to use inspection station Leica INS10.
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 Universal IR/VIS Inspection Microscope The Leica INM100 IR is a next step in the consistent development of our mi- croscope product line. The extension of the wavelength range to infrared en- ables the user to look “through” the sil- icon wafer allowing inspection of de- fects and failures which cannot be detected and visualized by other meth- ods. The applications which can be covered by the INM100 IR include inspection of metalization layers from the back side of the wafer, short and con-tact/bridge defects, inclusion tracing, flip-chip in- spection and inspection of buried structures.
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 Microscope System for the Toughest Requirements in the Semiconductor Industry The Leica INM200 with Ultraviolet op- tics is a high performance microscope for failure analysis in wafer and mask production with resolution down to a feature size of 0.13 µm.
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 Fully Automatic 300 mm DUV Microscope With Autofocus This entirely newly designed DUV micro- scope is derived from the Leica INM300 (universal inspection & failure analysis microscope). Key features are the Leica HC Optics with DUV capability, the oper- ator-friendly fully comprehensive au- tomation and the innovative laser-auto focusing (patent pending) of the visible light and DUV image. The microscope’s ultra-high resolution makes it ideal for fulfilling the demands of the new design rules featuring 0.13 µm or below.
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 Defect Detection With DUV ATTechnology Leica’s Insepction and Review Station INS3000DUV combines robust and proven technology with innovative op- tics to create a flexible solution for wafer sizes up to 200 mm. All illumina- tion modes are fully automated and can be combined at will to permit optimal use of the system in any fab environ- ment.
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 Perfect Quality Control in Wafer Production The brand new inspection and review system Leica INS3300 is the ultimate so- lution for 300 mm wafer applications. A flexible system layout and the integrat- ed software capabilities allow perfect integration in the 300 mm fab automa- tion process. The ingenious handling concept in combination with high per- formance DUV optics guarantees high throughput at resolutions down to 80 nm.
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 Automatic Detection of Macro and Micro Defects Today's volume production, increasing wafer sizes and the complexity of “state-of-the-art” processes require new solutions in defect monitoring. The brand new Leica LDS3000 is the an- swer. Whether your basic interest is in eliminating macro-defects, or simply doing inline SpotCheck inspection, the Leica LDS3000 is just what you were looking for.
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 Automatic Detection of Macro and Micro Defects Automated defect detection, classifica- tion and inline review for 300 mm fabs. The LDS3300C keeps the advantages of the field-proven INS3300 inspection and review system and combines them with a new intelligence of inspecting the en- tire surface of a 300 mm wafer at highest throughput.
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 Automatic Macro Defect Detection and Classification System With High Troughput The brand new automatic macro defect detection and classification system Leica LDS3300M is the ultimate solu- tion for all 300 mm wafer applications. A flexible system layout and the in- tegrated software capabilities allows for a perfect integration in the 300 mm fab automation process.
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 Pattern Placement Metrology System High performance pattern placement and CD metrology system for masks and wafers of up to 300 mm sample size. Flexible feature edge detection using image analysis enables the engineer to solve various kinds of day-by-day prob- lems, e.g. process control on non-or- thogonal features. Flexible and comprehensive data analysis software provides valuable in- formation on pattern generator, pro- cess quality, and product quality.
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 Transmitted Light Optical CD Meassurement System The Leica LWM500 WI is the first opti- cal critical dimension (CD) measure- ment system for the 65 nm device gen- eration to use water immersion technology for significantly enhanced resolution and image contrast. It can measure linewidth on photomasks very accurately by using transmitted light DUV illumination at 248 nm.
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 CD Measurement System with Outstanding Long-Time Stability The new Leica LWM9000 SEM is a CD SEM measurement system for 65 nm node reticles with ultra low charging and contamination.Therefore, the measure- ment stability is outstanding.
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 Electron Beam Tools for the Semiconductor Industry The Leica SB351DW is today’s most ad- vanced direct write electron beam sys- tem in terms of throughput, accuracy and automation. The specific architec- ture of the SB system allows the per- formance of high-precision direct-write patterning down to 50 nm while also achieving excellent throughput – the criteria for using these tools in produc- tion. Fully automatic wafer handling and network-supported operation soft- ware facilitate its easy integration into the automated production environment (CIM).
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 For Optoelectronics, Nanotechnology and Next-Generation Lithography The Vectorbeam series systems of Leica Microsystems provide leading edge technology solutions for today’s nanolithography production environ- ments. They feature excellent control, extreme placement and overlay accuracy, eco- nomic throughput and high reliability. This places the Vectorbeam systems at the forefront of tomorrow’s tech- nology, addressing state-of-the-art sili- con, compound semiconductor, opto- electronics and nano-device applica- tions.
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Equipment 